Issued Patents All Time
Showing 26–50 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9899311 | Hybrid pitch package with ultra high density interconnect capability | Mathew J. Manusharow, Daniel N. Sobieski, William J. Lambert | 2018-02-20 |
| 9820390 | Process for forming a semiconductor device substrate | Islam A. Salama, Yonggang Li | 2017-11-14 |
| 9741686 | Electronic package and method of connecting a first die to a second die to form an electronic package | Harold Ryan Chase, Mathew J. Manusharow | 2017-08-22 |
| 9711441 | Reduced PTH pad for enabling core routing and substrate layer count reduction | Debendra Mallik | 2017-07-18 |
| 9704735 | Dual side solder resist layers for coreless packages and packages with an embedded interconnect bridge and their methods of fabrication | Manohar S. Konchady, Tao Wu, Wei-Lun Kane Jen, Yi Li | 2017-07-11 |
| 9633938 | Hybrid pitch package with ultra high density interconnect capability | Mathew J. Manusharow, Daniel N. Sobieski, William J. Lambert | 2017-04-25 |
| 9622350 | Method of forming a circuit board | Mathew J. Manusharow | 2017-04-11 |
| 9552977 | Landside stiffening capacitors to enable ultrathin and other low-Z products | Mathew J. Manusharow | 2017-01-24 |
| 9548264 | High density organic bridge device and method | Stefanie M. Lotz, Wei-Lun Kane Jen | 2017-01-17 |
| 9526175 | Suspended inductor microelectronic structures | Mathew J. Manusharow, Kaladhar Radhakrishnan, Debendra Mallik, Edward A. Burton | 2016-12-20 |
| 9521751 | Weaved electrical components in a substrate package core | Mathew J. Manusharow | 2016-12-13 |
| 9406587 | Substrate conductor structure and method | Harold Ryan Chase, Mathew J. Manusharow, Mark S. Hlad | 2016-08-02 |
| 9355952 | Device packaging with substrates having embedded lines and metal defined pads | Mark S. Hlad, Islam A. Salama, Tao Wu, Yueli Liu, Kyu Oh Lee | 2016-05-31 |
| 9275975 | Electronic package and method of connecting a first die to a second die to form an electronic package | Harold Ryan Chase, Mathew J. Manusharow | 2016-03-01 |
| 9236366 | High density organic bridge device and method | Stephanie M. Lotz, Wei-Lun Kane Jen | 2016-01-12 |
| 9210809 | Reduced PTH pad for enabling core routing and substrate layer count reduction | Debendra Mallik | 2015-12-08 |
| 9198293 | Non-cylindrical conducting shapes in multilayer laminated substrate cores | Harold Ryan Chase, Mathew J. Manusharow, Mark S. Hlad | 2015-11-24 |
| 9111916 | In situ-built pin-grid arrays for coreless substrates, and methods of making same | Mathew J. Manusharow | 2015-08-18 |
| 9093313 | Device packaging with substrates having embedded lines and metal defined pads | Mark S. Hlad, Islam A. Salama, Tao Wu, Yueli Liu, Kyu Oh Lee | 2015-07-28 |
| 8952540 | In situ-built pin-grid arrays for coreless substrates, and methods of making same | Mathew J. Manusharow | 2015-02-10 |
| 8928151 | Hybrid core through holes and vias | Islam A. Salama, Yonggang Li | 2015-01-06 |
| 8907461 | Heat dissipation device embedded within a microelectronic die | Manohar S. Konchady | 2014-12-09 |
| 8866308 | High density interconnect device and method | Mathew J. Manusharow | 2014-10-21 |
| 8835217 | Device packaging with substrates having embedded lines and metal defined pads | Mark S. Hlad, Islam A. Salama, Tao Wu, Yueli Liu, Kyu Oh Lee | 2014-09-16 |
| 8659171 | Patch on interposer assembly and structures formed thereby | Brent M. Roberts, Sriram Srinivasan | 2014-02-25 |