Issued Patents All Time
Showing 51–59 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8617990 | Reduced PTH pad for enabling core routing and substrate layer count reduction | Debendra Mallik | 2013-12-31 |
| 8552564 | Hybrid-core through holes and vias | Islam A. Salama, Yonggang Li | 2013-10-08 |
| 8450857 | Through mold via polymer block package | Islam A. Salama, Charavana K. Gurumurthy, Robert L. Sankman | 2013-05-28 |
| 8440506 | Microelectronic package and method for a compression-based mid-level interconnect | Brent M. Roberts, Sriram Sriniyasan, Sridhar Narasimhan | 2013-05-14 |
| 8389337 | Patch on interposer assembly and structures formed thereby | Brent M. Roberts, Sriram Srinivasan | 2013-03-05 |
| 8381393 | Patch on interposer through PGA interconnect structures | Brent M. Roberts, Sriram Srinivasan, Sridhar Narasimhan | 2013-02-26 |
| 8278752 | Microelectronic package and method for a compression-based mid-level interconnect | Brent M. Roberts, Sriram Srinivasan, Sridhar Narasimhan | 2012-10-02 |
| 8278214 | Through mold via polymer block package | Islam A. Salama, Charavana K. Gurumurthy, Robert L. Sankman | 2012-10-02 |
| 8227706 | Coaxial plated through holes (PTH) for robust electrical performance | Mahadevan Suryakumar, Yonggang Li | 2012-07-24 |