Issued Patents All Time
Showing 51–75 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9224674 | Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages | Pramod Malatkar, Weng Hong Teh, Robert L. Sankman | 2015-12-29 |
| 9153552 | Bumpless build-up layer package including an integrated heat spreader | Weng Hong Teh, Deepak Kulkarni, Chia-Pin Chiu, Tannaz Harirchian | 2015-10-06 |
| 9147669 | Recessed and embedded die coreless package | — | 2015-09-29 |
| 9136236 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan | 2015-09-15 |
| 9113547 | Same layer microelectronic circuit patterning using hybrid laser projection patterning (LPP) and semi-additive patterning(SAP) | Yonggang Li | 2015-08-18 |
| 9001520 | Microelectronic structures having laminated or embedded glass routing structures for high density packaging | Qing Ma, Johanna M. Swan, Robert Starkston, Robert L. Sankman, Aleksandar Aleksov | 2015-04-07 |
| 8987065 | Forming functionalized carrier structures with coreless packages | Ravi K. Nailla, Javier Soto Gonzalez, Drew W. Delaney, Hamid Azimi | 2015-03-24 |
| 8969140 | Embedded semiconductive chips in reconstituted wafers, and systems containing same | Robert L. Sankman | 2015-03-03 |
| 8941128 | Passivation layer for flexible display | Ravi Pillarisetty, Sairam Agraharam, Christopher J. Jezewski | 2015-01-27 |
| 8937382 | Secondary device integration into coreless microelectronic device packages | Weng Hong Teh | 2015-01-20 |
| 8912670 | Bumpless build-up layer package including an integrated heat spreader | Weng Hong Teh, Deepak Kulkarni, Chia-Pin Chiu, Tannaz Harirchian | 2014-12-16 |
| 8901724 | Semiconductor package with embedded die and its methods of fabrication | Javier Soto Gonzalez, Nicholas R. Watts, Ravi Kiran Nalla | 2014-12-02 |
| 8891246 | System-in-package using embedded-die coreless substrates, and processes of forming same | Vijay K. Nair | 2014-11-18 |
| 8860205 | Method of stiffening coreless package substrate | Sriram Muthukumar, Nicholas R. Watts | 2014-10-14 |
| 8786066 | Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same | Ravi Kiran Nalla, Javier Soto Gonzalez, Drew W. Delaney, Suresh Pothukuchi, Mohit Mamodia +2 more | 2014-07-22 |
| 8742561 | Recessed and embedded die coreless package | — | 2014-06-03 |
| 8618652 | Forming functionalized carrier structures with coreless packages | Ravi Kiran Nalla, Javier Soto Gonzalez, Drew W. Delaney, Hamid Azimi | 2013-12-31 |
| 8535989 | Embedded semiconductive chips in reconstituted wafers, and systems containing same | Robert L. Sankman | 2013-09-17 |
| 8513792 | Package-on-package interconnect stiffener | Sanka Ganesan, Yosuke Kanaoka, Ram Viswanath, Rajasekaran Swaminathan, Robert M. Nickerson +2 more | 2013-08-20 |
| 8313958 | Magnetic microelectronic device attachment | Rajasekaran Swaminathan, Ravindranath V. Mahajan | 2012-11-20 |
| 8264849 | Mold compounds in improved embedded-die coreless substrates, and processes of forming same | — | 2012-09-11 |
| 8093704 | Package on package using a bump-less build up layer (BBUL) package | Eric Palmer | 2012-01-10 |
| 8035218 | Microelectronic package and method of manufacturing same | Mahadevan Survakumar, Hamid Azimi | 2011-10-11 |
| 7851269 | Method of stiffening coreless package substrate | Sriram Muthukumar, Nicholas R. Watts | 2010-12-14 |
| 7636231 | Organic substrates with embedded thin-film capacitors, methods of making same, and systems containing same | Cengiz A. Palanduz, Victor Prokofiev | 2009-12-22 |