Issued Patents All Time
Showing 26–50 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9832860 | Panel level fabrication of package substrates with integrated stiffeners | Robert Starkston, Patrick Nardi, Keith Jones, Javier Soto Gonzalez | 2017-11-28 |
| 9820384 | Flexible electronic assembly method | Sasha N. Oster, Robert L. Sankman, Charles A. Gealer, Omkar G. Karhade, Ravi Mahajan +8 more | 2017-11-14 |
| 9780054 | Semiconductor package with embedded die and its methods of fabrication | Javier Soto Gonzalez, Nicholas R. Watts, Ravi Kiran Nalla | 2017-10-03 |
| 9713255 | Electro-magnetic interference (EMI) shielding techniques and configurations | Adel A. Elsherbini, Ravindranath V. Mahajan, Nitin A. Deshpande | 2017-07-18 |
| 9691728 | BBUL top side substrate layer enabling dual sided silicon interconnect and stacking flexibility | Robert M. Nickerson, Min Tao | 2017-06-27 |
| 9691711 | Method of making an electromagnetic interference shield for semiconductor chip packages | Ravindranath V. Mahajan, Adel A. Elsherbini, Nitin A. Deshpande | 2017-06-27 |
| 9686870 | Method of forming a microelectronic device package | Weng Hong Teh | 2017-06-20 |
| 9679843 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, Chia-Pin Chiu, Deepak Kulkarni, Ravindranath V. Mahajan | 2017-06-13 |
| 9646851 | Embedded semiconductive chips in reconstituted wafers, and systems containing same | Robert L. Sankman | 2017-05-09 |
| 9642248 | Microelectronic structures having laminated or embedded glass routing structures for high density packaging | Qing Ma, Johanna M. Swan, Robert Starkston, Robert L. Sankman, Aleksandar Aleksov | 2017-05-02 |
| 9576909 | Bumpless die-package interface for bumpless build-up layer (BBUL) | Weng Hong Teh, Robert L. Sankman | 2017-02-21 |
| 9572258 | Method of forming a substrate core with embedded capacitor and structures formed thereby | Sriram Srinivasan, Cengiz A. Palanduz, Victor Prokofiev, Joel Auernheimer | 2017-02-14 |
| 9553075 | Recessed and embedded die coreless package | — | 2017-01-24 |
| 9526285 | Flexible computing fabric | Aleksandar Aleksov, Ravindranath V. Mahajan, Sairam Agraharam, Ian A. Young, John C. Johnson +1 more | 2016-12-27 |
| 9520376 | Bumpless build-up layer package including an integrated heat spreader | Weng Hong Teh, Deepak Kulkarni, Chia-Pin Chiu, Tannaz Harirchian | 2016-12-13 |
| 9496211 | Logic die and other components embedded in build-up layers | Deepak Kulkarni, Russell K. Mortensen | 2016-11-15 |
| 9490196 | Multi die package having a die and a spacer layer in a recess | Weng Hong Teh, Shan Zhong | 2016-11-08 |
| 9406618 | Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same | Ravi Kiran Nalla, Javier Solo Gonzalez, Drew W. Delaney, Suresh Pothukuchi, Mohit Mamodia +2 more | 2016-08-02 |
| 9397071 | High density interconnection of microelectronic devices | Omkar G. Karhade, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande, William J. Lambert +6 more | 2016-07-19 |
| 9374509 | Wearable imaging sensor for communications | Ravi Pillarisetty, Sairam Agraharam, Christopher J. Jezewski | 2016-06-21 |
| 9368455 | Electromagnetic interference shield for semiconductor chip packages | Ravindranath V. Mahajan, Adel A. Elsherbini, Nitin A. Deshpande | 2016-06-14 |
| 9312233 | Method of forming molded panel embedded die structure | Rahul N. Manepalli, Hamid Azimi | 2016-04-12 |
| 9287248 | Embedded memory and power management subpackage | Debendra Mallik, Sasha N. Oster, Timothy McIntosh | 2016-03-15 |
| 9269701 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan | 2016-02-23 |
| 9257380 | Forming functionalized carrier structures with coreless packages | Ravi Kiran Nalla, Javier Soto Gonzalez, Drew W. Delaney, Hamid Azimi | 2016-02-09 |