Issued Patents All Time
Showing 76–83 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7569471 | Method of providing mixed size solder bumps on a substrate using a solder delivery head | Mengzhi Pang | 2009-08-04 |
| 7525140 | Integrated thin film capacitors with adhesion holes for the improvement of adhesion strength | Yongki Min | 2009-04-28 |
| 7485563 | Method of providing solder bumps of mixed sizes on a substrate using a sorting mask and bumped substrate formed according to the method | Mengzhi Pang | 2009-02-03 |
| 7372126 | Organic substrates with embedded thin-film capacitors, methods of making same, and systems containing same | Cengiz A. Palanduz, Victor Prokofiev | 2008-05-13 |
| 7288459 | Organic substrates with integral thin-film capacitors, methods of making same, and systems containing same | Victor Prokofiev | 2007-10-30 |
| 7224571 | Forming a substrate core with embedded capacitor and structures formed thereby | Sriram Srinivasan, Cengiz A. Palanduz, Victor Prokofiev, Joel Auernheimer | 2007-05-29 |
| 7042077 | Integrated circuit package with low modulus layer and capacitor/interposer | Michael Walk, Hamid Azimi, Charan Gurumurthy | 2006-05-09 |
| 6867491 | Metal core integrated circuit package with electrically isolated regions and associated methods | Dustin P. Wood | 2005-03-15 |