Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9572258 | Method of forming a substrate core with embedded capacitor and structures formed thereby | Sriram Srinivasan, John S. Guzek, Cengiz A. Palanduz, Joel Auernheimer | 2017-02-14 |
| 7636231 | Organic substrates with embedded thin-film capacitors, methods of making same, and systems containing same | John S. Guzek, Cengiz A. Palanduz | 2009-12-22 |
| 7470147 | Spring biased socket system | — | 2008-12-30 |
| 7372126 | Organic substrates with embedded thin-film capacitors, methods of making same, and systems containing same | John S. Guzek, Cengiz A. Palanduz | 2008-05-13 |
| 7288459 | Organic substrates with integral thin-film capacitors, methods of making same, and systems containing same | John S. Guzek | 2007-10-30 |
| 7235880 | IC package with power and signal lines on opposing sides | — | 2007-06-26 |
| 7224571 | Forming a substrate core with embedded capacitor and structures formed thereby | Sriram Srinivasan, John S. Guzek, Cengiz A. Palanduz, Joel Auernheimer | 2007-05-29 |
| 7209366 | Delivery regions for power, ground and I/O signal paths in an IC package | Cengiz A. Palanduz | 2007-04-24 |
| 7176575 | Input/output routing on an electronic device | Larry E. Mosley, Cengiz A. Palanduz | 2007-02-13 |
| 6809260 | Apparatus and method for an integrated high-performance electrical interconnect | — | 2004-10-26 |
| 6795296 | Capacitor device and method | Cengiz A. Palanduz | 2004-09-21 |