Issued Patents All Time
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659889 | Solder-on-die using water-soluble resist system and method | Mihir A. Oka, Dingying Xu, Edward R. Prack, Kabirkumar Mirpuri, Saikumar Jayaraman | 2017-05-23 |
| 9620404 | Stiffener tape for electronic assembly that includes wafer or panel | Arjun Krishnan | 2017-04-11 |
| 9437468 | Heat assisted handling of highly warped substrates post temporary bonding | Huan Ma | 2016-09-06 |
| 8969134 | Laser ablation tape for solder interconnect formation | Takashi Kumamoto, Sufi Ahmed | 2015-03-03 |