Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840213 | Bonding system | Masataka Matsunaga, Takahiro Masunaga, Takashi Koga, Shogo HARA, Masaaki Umitsuki +2 more | 2020-11-17 |
| 9679798 | Substrate conveyance apparatus and substrate peeling system | Yasuharu Iwashita, Osamu Hirakawa, Takeshi Tamura, Kazutaka Noda, Xavier Francois Brun +1 more | 2017-06-13 |