Issued Patents All Time
Showing 26–50 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10014277 | Single layer low cost wafer level packaging for SFF SiP | Vijay K. Nair | 2018-07-03 |
| 9951410 | Infrared surface light source generating device and method of manufacturing same | — | 2018-04-24 |
| 9942980 | Wavy interconnect for bendable and stretchable devices | Adel A. Elsherbini, Yoshihiro Tomita, Shawna M. Liff | 2018-04-10 |
| 9930793 | Electric circuit on flexible substrate | Siddarth Kumar | 2018-03-27 |
| 9848490 | Solder in cavity interconnection technology | — | 2017-12-19 |
| 9761514 | Substrate for integrated circuit devices including multi-layer glass core and methods of making the same | Qing Ma, Patrick Morrow | 2017-09-12 |
| 9741645 | Dense interconnect with solder cap (DISC) formation with laser ablation and resulting semiconductor structures and packages | — | 2017-08-22 |
| 9685390 | Microelectronic package having non-coplanar, encapsulated microelectronic devices and a bumpless build-up layer | — | 2017-06-20 |
| 9673131 | Integrated circuit package assemblies including a glass solder mask layer | Qing Ma, Chia-Pin Chiu | 2017-06-06 |
| 9659885 | Semiconductor device with pre-molding chip bonding | — | 2017-05-23 |
| 9543197 | Package with dielectric or anisotropic conductive (ACF) buildup layer | Dingying Xu, Yoshihiro Tomita | 2017-01-10 |
| 9530747 | Solder in cavity interconnection structures | Shawna M. Liff, Gregory S. Clemons | 2016-12-27 |
| 9508675 | Microelectronic package having direct contact heat spreader and method of manufacturing same | Daoqiang Lu, Gilroy Vandentop, Shriram Ramanathan, Rajashree Baskaran, Valery M. Dubin | 2016-11-29 |
| 9461355 | Method apparatus and material for radio frequency passives and antennas | Vijay K. Nair, Shawna M. Liff, Larry E. Mosley | 2016-10-04 |
| 9420707 | Substrate for integrated circuit devices including multi-layer glass core and methods of making the same | Qing Ma, Patrick Morrow | 2016-08-16 |
| 9281292 | Single layer low cost wafer level packaging for SFF SiP | Vijay K. Nair | 2016-03-08 |
| 9072187 | Off-plane conductive line interconnects in microelectronic devices | — | 2015-06-30 |
| 9006890 | Solder in cavity interconnection structures | Shawna M. Liff, Gregory S. Clemons | 2015-04-14 |
| 8936967 | Solder in cavity interconnection structures | Shawna M. Liff, Gregory S. Clemons | 2015-01-20 |
| 8872355 | Semiconductor device with pre-molding chip bonding | — | 2014-10-28 |
| 8663485 | Method of manufacturing plastic metallized three-dimensional circuit | Chen-Lung Tsai, Yu-Wei Chen, Chen-Hao Chang | 2014-03-04 |
| 8541876 | Microelectronic package having direct contact heat spreader and method of manufacturing same | Daoqiang Lu, Gilroy Vandentop, Shriram Ramanathan, Rajashree Baskaran, Valery M. Dubin | 2013-09-24 |
| 8424748 | Solder in cavity interconnection technology | — | 2013-04-23 |
| 8080870 | Die-warpage compensation structures for thinned-die devices, and methods of assembling same | — | 2011-12-20 |
| 7888183 | Thinned die integrated circuit package | Cheng-Yi Liu, Johanna M. Swan, Steven Towle | 2011-02-15 |