Issued Patents All Time
Showing 76–100 of 114 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7755186 | Cooling solutions for die-down integrated circuit packages | Ioan Sauciuc | 2010-07-13 |
| 7637751 | Skived electrical contact for connecting an IC device to a circuit board and method of making a contact by skiving | — | 2009-12-29 |
| 7638874 | Microelectronic package including temperature sensor connected to the package substrate and method of forming same | John P. Dirner | 2009-12-29 |
| 7579686 | Thermal interface material with hotspot heat remover | Xuejiao Hu | 2009-08-25 |
| 7566228 | Skived electrical contact for connecting an IC device to a circuit board and method of making a contact by skiving | — | 2009-07-28 |
| 7511372 | Microelectronic die cooling device including bonding posts and method of forming same | — | 2009-03-31 |
| 7332423 | Soldering a die to a substrate | Robert Starkston, Sridhar Narasimhan, Suzana Prstic, Patrick Neel Stover, Hong Xie | 2008-02-19 |
| 7327028 | Embedded heat spreader for folded stacked chip-scale package | — | 2008-02-05 |
| 7312527 | Low temperature phase change thermal interface material dam | Sandeep B. Sane, Nitin A. Deshpande | 2007-12-25 |
| 7259965 | Integrated circuit coolant microchannel assembly with targeted channel configuration | Je-Young Chang, Ioan Sauciuc, Chuan Hu, Gregory M. Chrysler, Ravi Prasher +3 more | 2007-08-21 |
| 7251139 | Thermal management arrangement for standardized peripherals | Anandaroop Bhattacharya, Sridhar Machiroutu | 2007-07-31 |
| 7243705 | Integrated circuit coolant microchannel with compliant cover | Alan M. Myers, Je-Young Chang, Ravi Prasher, Ioan Sauciuc, Gregory M. Chrysler +1 more | 2007-07-17 |
| 7202111 | Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device | — | 2007-04-10 |
| 7199466 | Package design using thermal linkage from die to printed circuit board | — | 2007-04-03 |
| 7025129 | Adhesive to attach a cooling device to a thermal interface | — | 2006-04-11 |
| 6965163 | Substrate-less microelectronic package | — | 2005-11-15 |
| 6890217 | Integrated socket for microprocessor package and cache memory | — | 2005-05-10 |
| 6869825 | Folded BGA package design with shortened communication paths and more electrical routing flexibility | — | 2005-03-22 |
| 6841855 | Electronic package having a flexible substrate with ends connected to one another | Edward Jaeck | 2005-01-11 |
| 6840794 | Apparatus and methods for cooling a processor socket | — | 2005-01-11 |
| 6794748 | Substrate-less microelectronic package | — | 2004-09-21 |
| 6767765 | Methods and apparatus for disposing a thermal interface material between a heat source and a heat dissipation device | — | 2004-07-27 |
| 6651736 | Short carbon fiber enhanced thermal grease | James C. Shipley, Craig B. Simmons | 2003-11-25 |
| 6626681 | Integrated socket for microprocessor package and cache memory | — | 2003-09-30 |
| 6580611 | Dual-sided heat removal system | Gilroy Vandentop, Raj Nair, Yuan-Liang Li | 2003-06-17 |