Issued Patents All Time
Showing 101–114 of 114 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6523608 | Thermal interface material on a mesh carrier | Gary Solbrekken, Craig B. Simmons | 2003-02-25 |
| 6519154 | Thermal bus design to cool a microelectronic die | — | 2003-02-11 |
| 6390475 | Electro-mechanical heat sink gasket for shock and vibration protection and EMI suppression on an exposed die | Michael Z. Eckblad, Russell S. Aoki, Correy D. Cooks, Richard Zhao | 2002-05-21 |
| 6315038 | Application of pressure sensitive adhesive (PSA) to pre-attach thermal interface film/tape to cooling device | — | 2001-11-13 |
| 6154365 | Spring fixture that attaches a heat sink to a substrate for multiple cycle assembly/disassembly | Lloyd L. Pollard, II | 2000-11-28 |
| 6150195 | Method for an integrated circuit thermal grease mesh structure | Nadir Sharaf, Gary Solbrekken, Correy D. Cooks | 2000-11-21 |
| 6121680 | Mesh structure to avoid thermal grease pump-out in integrated circuit heat sink attachments | Nadir Sharaf, Gary Solbrekken, Correy D. Cooks | 2000-09-19 |
| 5990549 | Thermal bus bar design for an electronic cartridge | Imran Yusuf, Banerjee Koushik, Todd Young, Gary Solbrekken | 1999-11-23 |
| 5965937 | Thermal interface attach mechanism for electrical packages | Gregory Turturro | 1999-10-12 |
| 5953209 | Push and pull dual-fan heat sink design | — | 1999-09-14 |
| 5936838 | MPC module with exposed C4 die and removal thermal plate design | Mirng-Ji Lii, Gregory Turturro | 1999-08-10 |
| 5621245 | Apparatus for optimizing operating parameters of an integrated circuit package having a voltage regulator mounted thereon | Willy Agatstein, Mostafa Aghazadeh, Amar Ghori, James R. M. Neal, Gregory Turturio | 1997-04-15 |
| 5556811 | Method of optimizing operating parameters of an integrated circuit package having a voltage regulator mounted thereon | Willy Agatstein, Mostafa Aghazadeh, Amar Ghori, James R. M. Neal, Gregory Turturio | 1996-09-17 |
| 5513070 | Dissipation of heat through keyboard using a heat pipe | Hong Xie, Mostafa Aghazadeh, Gregory Turturro | 1996-04-30 |