Issued Patents All Time
Showing 51–75 of 114 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9679843 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Deepak Kulkarni, Ravindranath V. Mahajan | 2017-06-13 |
| 9673131 | Integrated circuit package assemblies including a glass solder mask layer | Chuan Hu, Qing Ma | 2017-06-06 |
| 9666549 | Methods for solder for through-mold interconnect | Xiaorong Xiong, Linda Zhang, Robert M. Nickerson, Charles A. Gealer | 2017-05-30 |
| 9589866 | Bridge interconnect with air gap in package assembly | Zhiguo Qian, Mathew J. Manusharow | 2017-03-07 |
| 9520376 | Bumpless build-up layer package including an integrated heat spreader | Weng Hong Teh, Deepak Kulkarni, Tannaz Harirchian, John S. Guzek | 2016-12-13 |
| 9437569 | High density substrate routing in BBUL package | Weng Hong Teh | 2016-09-06 |
| 9349703 | Method for making high density substrate interconnect using inkjet printing | Kinya Ichikawa, Robert L. Sankman | 2016-05-24 |
| 9275971 | Bridge interconnect with air gap in package assembly | Zhiguo Qian, Mathew J. Manusharow | 2016-03-01 |
| 9269701 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Deepak Kulkarni, Ravi Mahajan | 2016-02-23 |
| 9263329 | Methods of connecting a first electronic package to a second electronic package | Kinya Ichikawa, Yoshihiro Tomita, Robert L. Sankman, Eric J. Li | 2016-02-16 |
| 9244487 | Integrated translational land-grid array sockets and loading mechanisms for semiconductive devices | Russell S. Aoki, Anthony P. Valpiani, Barry T. Dale | 2016-01-26 |
| 9241423 | Fluid-cooled heat dissipation device | — | 2016-01-19 |
| 9190380 | High density substrate routing in BBUL package | Weng Hong Teh | 2015-11-17 |
| 9177831 | Die assembly on thin dielectric sheet | Qing Ma, Robert L. Sankman, Paul B. Fischer, Patrick Morrow, William J. Lambert +2 more | 2015-11-03 |
| 9171816 | High density substrate routing in BBUL package | Weng Hong Teh | 2015-10-27 |
| 9159690 | Tall solders for through-mold interconnect | Xiaorong Xiong, Linda Zhang, Robert M. Nickerson, Charles A. Gealer | 2015-10-13 |
| 9153552 | Bumpless build-up layer package including an integrated heat spreader | Weng Hong Teh, Deepak Kulkarni, Tannaz Harirchian, John S. Guzek | 2015-10-06 |
| 9136236 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Deepak Kulkarni, Ravi Mahajan | 2015-09-15 |
| 8912670 | Bumpless build-up layer package including an integrated heat spreader | Weng Hong Teh, Deepak Kulkarni, Tannaz Harirchian, John S. Guzek | 2014-12-16 |
| 8872349 | Bridge interconnect with air gap in package assembly | Zhiguo Qian, Mathew J. Manusharow | 2014-10-28 |
| 8777675 | Vertical contact for shielded sockets | — | 2014-07-15 |
| 8622764 | Integrated translational land-grid array sockets and loading mechanisms for semiconductive devices | Russell S. Aoki, Anthony P. Valpiani, Barry T. Dale | 2014-01-07 |
| 8227904 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more | 2012-07-24 |
| 7875973 | Package substrate including surface mount component mounted on a peripheral surface thereof and microelectronic package including same | — | 2011-01-25 |
| 7851905 | Microelectronic package and method of cooling an interconnect feature in same | Gregory M. Chrysler, Ravi Mahajan | 2010-12-14 |