Issued Patents All Time
Showing 26–50 of 70 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522454 | Microelectronic package having a passive microelectronic device disposed within a package body | Thorsten Meyer, Gerald Ofner, Georg Seidemann, Sven Albers, Christian Geissler | 2019-12-31 |
| 10522485 | Electrical device and a method for forming an electrical device | Christian Geissler, Sven Albers, Georg Seidemann, Klaus Reingruber, Thomas Wagner +1 more | 2019-12-31 |
| 10490527 | Vertical wire connections for integrated circuit package | Christian Geissler, Sven Albers, Georg Seidemann, Klaus Reingruber, Thomas Wagner +1 more | 2019-11-26 |
| 10431545 | Cross-connected multi-chip modules coupled by silicon bent-bridge interconnects and methods of assembling same | Georg Seidemann, Bernd Waidhas, Thomas Wagner, Laurent Millou | 2019-10-01 |
| 10411000 | Microelectronic package with illuminated backside exterior | Marc Dittes, Sven Albers, Christian Geissler, Klaus Reingruber, Georg Seidemann +2 more | 2019-09-10 |
| 10403609 | System-in-package devices and methods for forming system-in-package devices | Christian Geissler, Sven Albers, Georg Seidemann, Klaus Reingruber, Thomas Wagner +1 more | 2019-09-03 |
| 10403602 | Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory | Bernd Waidhas, Georg Seidemann, Andreas Augustin, Laurent Millou, Reinhard Mahnkopf +2 more | 2019-09-03 |
| 10373844 | Integrated circuit package configurations to reduce stiffness | Sven Albers, Sonja Koller, Thorsten Meyer, Georg Seidemann, Christian Geissler | 2019-08-06 |
| 10366968 | Interconnect structure for a microelectronic device | Klaus Reingruber, Georg Seidemann, Thomas Wagner, Bernd Waidhas | 2019-07-30 |
| 10319688 | Antenna on ceramics for a packaged die | Saravana Maruthamuthu, Mikael Bergholz Knudsen, Thorsten Meyer, Georg Seidemann, Pablo Herrero +1 more | 2019-06-11 |
| 10290412 | Vertical inductor for WLCSP | Thorsten Meyer, Gerhard Knoblinger | 2019-05-14 |
| 10228725 | Flexible band wearable electronic device | Sven Albers, Klaus Reingruber, Georg Seidemann, Christian Geissler, Thorsten Meyer +1 more | 2019-03-12 |
| 10229858 | Conductive paths through dielectric with a high aspect ratio for semiconductor devices | Thorsten Meyer | 2019-03-12 |
| 10209466 | Integrated circuit packages including an optical redistribution layer | Georg Seidemann, Christian Geissler, Sven Albers, Thomas Wagner, Marc Dittes +2 more | 2019-02-19 |
| 10141265 | Bent-bridge semiconductive apparatus | Bernd Waidhas, Stephan Stoeckl, Reinhard Mahnkopf, Georg Seidemann, Thomas Wagner +1 more | 2018-11-27 |
| 10121726 | Cooler for semiconductor devices | Sven Albers, Klaus Reingruber, Georg Seidemann, Christian Geissler, Alexandra Atzesdorfer +1 more | 2018-11-06 |
| 9997444 | Microelectronic package having a passive microelectronic device disposed within a package body | Thorsten Meyer, Gerald Ofner, Georg Seidemann, Sven Albers, Christian Geissler | 2018-06-12 |
| 9985005 | Chip package-in-package | Thorsten Meyer, Sven Albers | 2018-05-29 |
| 9921694 | Wearable computing device | Sven Albers, Klaus Reingruber, Teodora Ossiander, Sonja Koller, Georg Seidemann +3 more | 2018-03-20 |
| 9865387 | Electronic package with coil formed on core | Sven Albers, Klaus Reingruber | 2018-01-09 |
| 9819327 | Bulk acoustic wave resonator tuner circuits | Saravana Maruthamuthu, Thorsten Meyer, Pablo Herrero, Georg Seidemann, Mikael Bergholz Knudsen +1 more | 2017-11-14 |
| 9711492 | Three dimensional structures within mold compound | Sven Albers, Klaus Reingruber, Thorsten Meyer | 2017-07-18 |
| 9653324 | Integrated circuit package configurations to reduce stiffness | Sven Albers, Sonja Koller, Thorsten Meyer, Georg Seidemann, Christian Geissler | 2017-05-16 |
| 9576918 | Conductive paths through dielectric with a high aspect ratio for semiconductor devices | Thorsten Meyer | 2017-02-21 |
| 9397019 | Integrated circuit package configurations to reduce stiffness | Sven Albers, Sonja Koller, Thorsten Meyer, Georg Seidemann, Christian Geissler | 2016-07-19 |