Issued Patents All Time
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9583811 | Transition between a plastic waveguide and a semiconductor chip, where the semiconductor chip is embedded and encapsulated within a mold compound | Ernst Seler, Walter Hartner, Josef Boeck | 2017-02-28 |
| 9577852 | Common-mode suppressor based on differential transmission line | Alexander Glas, Hubert Werthmann, Josef-Paul Schaffer, Francesca Arcioni, Gabriele Bettineschi | 2017-02-21 |
| 9356332 | Integrated-circuit module with waveguide transition element | Ernst Seler, Walter Hartner | 2016-05-31 |
| 9349696 | Integrated antennas in wafer level package | Rudolf Lachner, Linus Maurer | 2016-05-24 |
| 9337159 | Semiconductor package with integrated microwave component | Ernst Seler, Walter Hartner, Josef Boeck | 2016-05-10 |
| 9337522 | Millimeter-wave system including a waveguide transition connected to a transmission line and surrounded by a plurality of vias | Saverio Trotta, Jagjit Singh Bal, Ernst Seler, Mehran Pour Mousavi | 2016-05-10 |
| 9230926 | Functionalised redistribution layer | Ernst Seler | 2016-01-05 |
| 9064787 | Integrated antennas in wafer level package | Josef Boeck, Rudolf Lachner, Thorsten Meyer | 2015-06-23 |
| 8952521 | Semiconductor packages with integrated antenna and method of forming thereof | Walter Hartner, Ottmar Geitner, Gottfried Beer, Klaus Pressel, Mehran Pour Mousavi | 2015-02-10 |
| 8866292 | Semiconductor packages with integrated antenna and methods of forming thereof | Gottfried Beer, Mehran Pour Mousavi | 2014-10-21 |
| 8669655 | Chip package and a method for manufacturing a chip package | Ottmar Geitner, Walter Hartner, Ulrich Wachter, Michael Bauer, Andreas Stueckjuergen | 2014-03-11 |
| 8624381 | Integrated antennas in wafer level package | Rudolf Lachner, Linus Maurer | 2014-01-07 |
| 8460967 | Integrated antennas in wafer level package | Rudolf Lachner, Linus Maurer | 2013-06-11 |
| 8451618 | Integrated antennas in wafer level package | Josef Boeck, Rudolf Lachner, Thorsten Meyer | 2013-05-28 |
| 8278749 | Integrated antennas in wafer level package | Rudolf Lachner, Linus Maurer | 2012-10-02 |