Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9373609 | Bump package and methods of formation thereof | Thiam Huat Lim, Kok Chai Goh | 2016-06-21 |
| 9209152 | Molding material and method for packaging semiconductor chips | Kok Chai Goh | 2015-12-08 |
| 9054063 | High power single-die semiconductor package | Kok Chai Goh | 2015-06-09 |