Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021004 | Embedded lid for low cost and improved thermal performance | Jaimal Mallory Wiliamson, Arvin Nono Verdeflor, Snehamay Sinha | 2024-06-25 |
| 11978709 | Integrated system-in-package with radiation shielding | Vivek Swaminathan Sridharan, Yiqi Tang, Christopher Daniel Manack, Rajen Manicon Murugan, Liang Wan | 2024-05-07 |
| 11404360 | Power module with enhanced heat dissipation | Zhemin Zhang, Yi Yan | 2022-08-02 |
| 11362047 | Integrated system-in-package with radiation shielding | Vivek Swaminathan Sridharan, Yiqi Tang, Christopher Daniel Manack, Rajen Manicon Murugan, Liang Wan | 2022-06-14 |
| 10573537 | Integrated circuit package mold assembly | — | 2020-02-25 |
| 10186431 | Integrated circuit package mold assembly | — | 2019-01-22 |
| 9698075 | Integration of backside heat spreader for thermal management | Archana Venugopal, Marie Denison, Luigi Colombo, Darvin R. Edwards | 2017-07-04 |
| 9496198 | Integration of backside heat spreader for thermal management | Archana Venugopal, Marie Denison, Luigi Colombo, Darvin R. Edwards | 2016-11-15 |
| 9040117 | Adhesion promotion in printed circuit boards | Abayomi I. Owei, Eric Yakobson | 2015-05-26 |
| 8142840 | Adhesion promotion in printed circuit boards | Abayomi I. Owei, Eric Yakobson | 2012-03-27 |
| 7682432 | Adhesion promotion in printed circuit boards | Abayomi I. Owei, Eric Yakobson | 2010-03-23 |
| 7232478 | Adhesion promotion in printed circuit boards | Abayomi I. Owei, Eric Yakobson | 2007-06-19 |
| 7106273 | Antenna mounting apparatus | James S. Brunson | 2006-09-12 |
| 7016193 | High efficiency counter-flow shelf cooling system | Joseph Jacques, Osvalso Garcia | 2006-03-21 |
| 6594148 | Airflow system | Maurice M. Guy, Osvaldo Garcia | 2003-07-15 |