Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021004 | Embedded lid for low cost and improved thermal performance | Hiep Xuan Nguyen, Jaimal Mallory Wiliamson, Snehamay Sinha | 2024-06-25 |
| 11227852 | Integrated circuit packaging | Honglin Guo, Jason Chien, Byron Lovell Williams, Jeffrey Alan West, Anderson Li | 2022-01-18 |
| 10629562 | Integrated circuit packaging | Honglin Guo, Jason Chien, Byron Lovell Williams, Jeffrey Alan West, Anderson Li | 2020-04-21 |
| 6319418 | Zig-zagged plating bus lines | Albert Loh, Steven Liew, William S. Villaviray | 2001-11-20 |