Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742253 | Selective mold placement on integrated circuit (IC) packages and methods of fabricating | Rajneesh Kumar, Srikanth Kulkarni | 2023-08-29 |
| 11211263 | Structure for arrayed partial molding of packages | Srikanth Kulkarni, Rajneesh Kumar | 2021-12-28 |