Issued Patents All Time
Showing 1–25 of 164 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11946816 | Wafer bonded piezoresistive and piezoelectric force sensor and related methods of manufacture | Julius Minglin Tsai | 2024-04-02 |
| 11914777 | Integrated systems with force or strain sensing and haptic feedback | Julius Minglin Tsai, Christopher Edwards, Ali Foughi | 2024-02-27 |
| 11609131 | Wafer bonded piezoresistive and piezoelectric force sensor and related methods of manufacture | Julius Minglin Tsai | 2023-03-21 |
| 11243126 | Wafer bonded piezoresistive and piezoelectric force sensor and related methods of manufacture | Julius Minglin Tsai | 2022-02-08 |
| 9673316 | Vertical semiconductor device having frontside interconnections | Christopher S. Blair, Sudarsan Uppili, Fanling H. Yang, Guillaume Bouche | 2017-06-06 |
| 9450052 | EEPROM memory cell with a coupler region and method of making the same | Eric Braun, Joel M. McGregor | 2016-09-20 |
| 9184113 | Methods of forming coaxial feedthroughs for 3D integrated circuits | Uppili Sridhar | 2015-11-10 |
| 9129710 | Dynamic trim method for non volatile memory products | Yi He, Larry Wang, Sean Patrick Lynch, Che Chen, Wei Zhao | 2015-09-08 |
| 8975685 | N-channel multi-time programmable memory devices | Yi He, Xiang Lu | 2015-03-10 |
| 8951856 | Low-noise, high-gain semiconductor device incorporating BCD (Bipolar-CMOS-DMOS) technology and process of making the same | Xiang Lu | 2015-02-10 |
| 8940631 | Methods of forming coaxial feedthroughs for 3D integrated circuits | Uppili Sridhar | 2015-01-27 |
| 8847365 | Inductors and methods for integrated circuits | Joseph P. Ellul, Khanh Tran, Edward Martin Godshalk | 2014-09-30 |
| 8796767 | Low-noise, high-gain semiconductor device incorporating BCD (bipolar-CMOS-DMOS) technology | Xiang Lu | 2014-08-05 |
| 8686543 | 3D chip package with shielded structures | Uppili Sridhar, Joseph P. Ellul, Yi-Sheng Anthony Sun, Elliott Simons | 2014-04-01 |
| 8630137 | Dynamic trim method for non-volatile memory products | Yi He, Larry Wang, Sean Patrick Lynch, Che Chen, Wei Zhao | 2014-01-14 |
| 8405115 | Light sensor using wafer-level packaging | Arkadii V. Samoilov, Chiung C. Lo, Prashanth S. Holenarsipur, James Patrick Long | 2013-03-26 |
| 8344478 | Inductors having inductor axis parallel to substrate surface | Joseph P. Ellul, Khanh Tran, Edward Martin Godshalk | 2013-01-01 |
| 7943473 | Minimum cost method for forming high density passive capacitors for replacement of discrete board capacitors using a minimum cost 3D wafer-to-wafer modular integration scheme | Joseph P. Ellul, Khanh Tran | 2011-05-17 |
| 7944750 | Multi-programmable non-volatile memory cell | David Kuan-Yu Liu, Venkatraman Prabhakar, Sridevi Rajagopalan Schmidt | 2011-05-17 |
| RE40976 | Common source EEPROM and flash memory | Gregorio Spadea | 2009-11-17 |
| 7535758 | One or multiple-times programmable device | David Kuan-Yu Liu, Venkatraman Prabhakar | 2009-05-19 |
| 7324387 | Low power high density random access memory flash cells and arrays | Venkatraman Prabhakar, Keyhan Sinai | 2008-01-29 |
| 6905929 | Single poly EPROM cell having smaller size and improved data retention compatible with advanced CMOS process | Richard B. Merrill, Min-hwa Chi | 2005-06-14 |
| 6830988 | Method of forming an isolation structure for an integrated circuit utilizing grown and deposited oxide | — | 2004-12-14 |
| 6606265 | Common source EEPROM and flash memory | Gregorio Spadea | 2003-08-12 |