Issued Patents All Time
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6093635 | High integrity borderless vias with HSQ gap filled patterned conductive layers | Richard J. Huang, Simon S. Chan, Lu You | 2000-07-25 |
| 6087724 | HSQ with high plasma etching resistance surface for borderless vias | Jeffrey A. Shields, Robert Chen, Robert Dawson | 2000-07-11 |
| 6083851 | HSQ with high plasma etching resistance surface for borderless vias | Jeffrey A. Shields, Robert Chen, Robert Dawson | 2000-07-04 |
| 6060384 | Borderless vias with HSQ gap filled patterned metal layers | Robert Chen, Jeffrey A. Shields, Robert Dawson | 2000-05-09 |
| 6046106 | High density plasma oxide gap filled patterned metal layers with improved electromigration resistance | Paul R. Besser, Guarionex Morales, Shekhar Pramanick | 2000-04-04 |
| 6043147 | Method of prevention of degradation of low dielectric constant gap-fill material | Robert Chen, Jeffrey A. Shields, Robert Dawson | 2000-03-28 |
| 6034420 | Electromigration resistant patterned metal layer gap filled with HSQ | — | 2000-03-07 |
| 6030891 | Vacuum baked HSQ gap fill layer for high integrity borderless vias | Richard J. Huang, Guarionex Morales | 2000-02-29 |
| 6008116 | Selective etching for improved dielectric interlayer planarization | — | 1999-12-28 |
| 5990558 | Reduced cracking in gap filling dielectrics | — | 1999-11-23 |
| 5982035 | High integrity borderless vias with protective sidewall spacer | Sunil Mehta | 1999-11-09 |
| 5973387 | Tapered isolated metal profile to reduce dielectric layer cracking | Robert Chen, Jeffrey A. Shields | 1999-10-26 |
| 5942801 | Borderless vias with HSQ gap filled metal patterns having high etching resistance | — | 1999-08-24 |
| 5925932 | Borderless vias | Sunil Mehta, Andre Stolmeijer | 1999-07-20 |
| 5888911 | HSQ processing for reduced dielectric constant | Minh Van Ngo, Lu You, Jean Y. Yang, Richard J. Huang | 1999-03-30 |
| 5888898 | HSQ baking for reduced dielectric constant | Minh Van Ngo, Terri Jo Kitson, Lu You, Simon S. Chan, Jean Y. Yang | 1999-03-30 |
| 5866945 | Borderless vias with HSQ gap filled patterned metal layers | Robert Chen, Jeffrey A. Shields, Robert Dawson | 1999-02-02 |
| 5738917 | Process for in-situ deposition of a Ti/TiN/Ti aluminum underlayer | Paul R. Besser | 1998-04-14 |
| 5582881 | Process for deposition of a Ti/TiN cap layer on aluminum metallization and apparatus | Paul R. Besser, Raymond T. Lee | 1996-12-10 |