Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Globally planarized backend compatible thin film resistor contact/interconnect process

Globally planarized backend compatible thin film resistor contact/interconnect process

US Patent 6607962 · Granted Aug 19, 2003

Estimated economic value: $152,083,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Low loss optical interposer2025
Wafer-based electronic component packaging2019
Techniques for adhesive control between a substrate and a die2018
Light sensor with vertical diode junctions2018
Fan-out and heterogeneous packaging of electronic components2017
Semiconductor device having trench capacitor structure integrated therein2017
Semiconductor device having capacitor integrated therein2016
Semiconductor device having capacitor integrated therein2015
Inductors and methods for integrated circuits2014
Inductors having inductor axis parallel to substrate surface2013
Slide and rotate display configurations for a handheld computing device2012
Minimum cost method for forming high density passive capacitors for replacement 2011