Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11977819 | Method of soil cover layer of solid waste landfill considering effect of plant root | Hefu Pu, Ming Min, Junjie Zheng, Xiaojun Wen | 2024-05-07 |
| 6573154 | High aspect ratio trench isolation process for surface micromachined sensors and actuators | Uppili Sridhar, Ranganathan Nagarajan, Yi-Nan Su | 2003-06-03 |