Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D985999 | Lid | — | 2023-05-16 |
| 9659900 | Semiconductor device having a die and through-substrate via | Arkadii V. Samoilov, Peter McNally, Tyler Parent | 2017-05-23 |
| 9331048 | Bonded stacked wafers and methods of electroplating bonded stacked wafers | Quanbo Zou, Uppili Sridhar, Amit S. Kelkar | 2016-05-03 |
| 9196587 | Semiconductor device having a die and through substrate-via | Arkadii V. Samoilov, Peter McNally, Tyler Parent | 2015-11-24 |
| 9105750 | Semiconductor device having a through-substrate via | Arkadii V. Samoilov, Tyler Parent | 2015-08-11 |
| 9040386 | Method for varied topographic MEMS cap process | Li Li, Amit S. Kelkar, Brian S. Poarch | 2015-05-26 |
| 8970043 | Bonded stacked wafers and methods of electroplating bonded stacked wafers | Quanbo Zou, Uppili Sridhar, Amit S. Kelkar | 2015-03-03 |
| 8963287 | Deep trench capacitor with conformally-deposited conductive layers having compressive stress | Lei Tian, Scott W. Barry | 2015-02-24 |
| 8742574 | Semiconductor device having a through-substrate via | Arkadii V. Samoilov, Tyler Parent | 2014-06-03 |
| 8487405 | Deep trench capacitor with conformally-deposited conductive layers having compressive stress | Lei Tian, Scott W. Barry | 2013-07-16 |
| 7027677 | Integrating optical components on a planar light circuit | Ruolin Li, Ut Tran, Jun Liu, Yi Ding, Hiroaki Fukuto | 2006-04-11 |