PF

Pang Dow Foo

IM Institute Of Microelectronics: 13 patents #2 of 153Top 2%
AT AT&T: 5 patents #3,608 of 18,772Top 20%
AL American Telephone And Telegraph Company, At&T Bell Laboratories: 1 patents #330 of 1,086Top 35%
TA Tyco Electronics Logistics Ag: 1 patents #64 of 200Top 35%
📍 Berkeley Heights, NJ: #95 of 1,035 inventorsTop 10%
🗺 New Jersey: #4,011 of 69,400 inventorsTop 6%
Overall (All Time): #225,919 of 4,157,543Top 6%
20
Patents All Time

Issued Patents All Time

Showing 1–20 of 20 patents

Patent #TitleCo-InventorsDate
6908825 Method of making an integrated circuit inductor wherein a plurality of apertures are formed beneath an inductive loop Shuming Xu, Hanhua Feng, Bai Xu, Uppili Sridhar 2005-06-21
6855640 Apparatus and process for bulk wet etch with leakage protection Zhe Wang, Qingxin Zhang, Hanhua Feng 2005-02-15
6765300 Micro-relay Dirk Wagenaar, Kay Krupka, Helmut Schlaak, Uppili Sridhar, Victor Donald Samper 2004-07-20
6670272 Method for reducing dishing in chemical mechanical polishing Shaoyu Wu, Joon Mo Kang 2003-12-30
6667516 RF LDMOS on partial SOI substrate Shuming Xu, Hanhua Feng 2003-12-23
6664596 Stacked LDD high frequency LDMOSFET Jun Cai, Narayanan Balasubramanian 2003-12-16
6503847 Room temperature wafer-to-wafer bonding by polydimethylsiloxane Yu Chen, Quanbo Zou, Uppili Sridhar 2003-01-07
6495903 Integrated circuit inductor Shuming Xu, Hanhua Feng, Bai Xu, Uppili Sridhar 2002-12-17
6489203 Stacked LDD high frequency LDMOSFET Jun Cai, Narayanan Balasubramanian 2002-12-03
6461902 RF LDMOS on partial SOI substrate Shuming Xu, Hanhua Feng 2002-10-08
6436810 Bi-layer resist process for dual damascene Rakesh Kumar, Leong Tee Koh 2002-08-20
6383855 High speed, low cost BICMOS process using profile engineering Minghui Gao, Haijun Zhao, Abhijit Bandyopadhyay 2002-05-07
6122975 CMOS compatible integrated pressure sensor Uppili Sridhar, Mnoon Yan Loke 2000-09-26
6007728 Design of a novel tactile sensor Lian Jun Liu, Mnoon Yan Loke 1999-12-28
5643838 Low temperature deposition of silicon oxides for device fabrication Robert E. Dean, Earl R. Lory, Leonard J. Olmer 1997-07-01
5616518 Process for fabricating integrating circuits Chien-Shing Pai 1997-04-01
5124014 Method of forming oxide layers by bias ECR plasma deposition Ajit S. Manocha, John F. Miner, Chien-Shing Pai 1992-06-23
5120680 Method for depositing dielectric layers Tai-Chan D. Huo, Man F. Yan 1992-06-09
5057455 Formation of integrated circuit electrodes William T. Lynch, Chien-Shing Pai 1991-10-15
4871420 Selective etching process Frank B. Alexander, Jr., Ronald J. Schutz 1989-10-03