Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7381629 | Method of forming through-wafer interconnects for vertical wafer level packaging | Chirayarikathuveedu Premachandran Sankarapillai, Ranganathan Nagarajan | 2008-06-03 |
| 7183176 | Method of forming through-wafer interconnects for vertical wafer level packaging | Chirayarikathuveedu Premachandran Sankarapillai, Ranganathan Nagarajan | 2007-02-27 |