Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7381629 | Method of forming through-wafer interconnects for vertical wafer level packaging | Ranganathan Nagarajan, Mohanraj Soundarapandian | 2008-06-03 |
| 7326629 | Method of stacking thin substrates by transfer bonding | Ranganathan Nagarajan | 2008-02-05 |
| 7183176 | Method of forming through-wafer interconnects for vertical wafer level packaging | Ranganathan Nagarajan, Mohanraj Soundarapandian | 2007-02-27 |