Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9301396 | Connecting element for a multi-chip module and multi-chip module | Björn Hoxhold, Axel Kaltenbacher | 2016-03-29 |
| 7436072 | Protected chip stack | Berndt Gammel | 2008-10-14 |
| 7389903 | Device and method for soldering contacts on semiconductor chips | Robert Bergmann | 2008-06-24 |
| 7335582 | Component | — | 2008-02-26 |
| 7253530 | Method for producing chip stacks | — | 2007-08-07 |
| 7229851 | Semiconductor chip stack | — | 2007-06-12 |
| 6930383 | Electronic component including a housing and a substrate | Hans-Jurgen Hacke, Axel Königer, Max Seitz, Rainer Tilgner | 2005-08-16 |
| 6915945 | Method for contact-connecting an electrical component to a substrate having a conductor structure | — | 2005-07-12 |
| 6906370 | Semiconductor component having a material reinforced contact area | Thomas Rohr | 2005-06-14 |
| 6872464 | Soldering agent for use in diffusion soldering processes, and method for producing soldered joints using the soldering agent | Vaidyanathan Kripesh | 2005-03-29 |
| 6709949 | Method for aligning structures on a semiconductor substrate | — | 2004-03-23 |
| 6597053 | Integrated circuit arrangement with a number of structural elements and method for the production thereof | Anton Anthofer | 2003-07-22 |
| 5969534 | Semiconductor testing apparatus | Werner Weber, Siegmar Koppe, Helmut Klose | 1999-10-19 |
| 5943563 | Method for producing a three-dimensional circuit arrangement | — | 1999-08-24 |
| 5930596 | Semiconductor component for vertical integration and manufacturing method | Helmut Klose, Werner Weber, Emmerich Bertagnolli, Siegmar Koppe | 1999-07-27 |
| 5902118 | Method for production of a three-dimensional circuit arrangement | — | 1999-05-11 |
| 5830803 | Method for filling contact holes using a doctor blade | — | 1998-11-03 |
| 5706578 | Method for producing a three-dimensional circuit arrangement | — | 1998-01-13 |