Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12249582 | SIP package structure | Yaojian Lin, Xueqing Chen, SHASHA ZHOU, Jian-Hong Chen, Shuo Liu | 2025-03-11 |
| 12148681 | Fan-out package structure and method for manufacturing the same | Yaojian Lin, Jian Zuo, Yinghua Gao, Shuo Liu | 2024-11-19 |
| 11854949 | Package structure having a plurality of chips attached to a lead frame by redistribution layer | Yaojian Lin, Shuo Liu, CHENYE HE | 2023-12-26 |