Issued Patents All Time
Showing 1–25 of 127 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417939 | Semiconductor device and method of detecting semiconductor wafer centered on tape | Tack Chee Yong, Yi Jing Eric Chong, Kok Lim Jason Ng | 2025-09-16 |
| 12381141 | Semiconductor device and method of forming hybrid substrate with uniform thickness | Yaojian Lin, Jian Zuo, Hin Hwa Goh | 2025-08-05 |
| RE48408 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Reza A. Pagaila, Seng Guan Chow, Seung Uk Yoon, Byung Tai Do | 2021-01-26 |
| RE48111 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Reza A. Pagaila, Seng Guan Chow, Seung Uk Yoon, Byung Tai Do | 2020-07-21 |
| 10388612 | Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits | Yaojian Lin, Byung Joon Han, Rajendra D. Pendse, Il Kwon Shim, Pandi C. Marimuthu +1 more | 2019-08-20 |
| 10388584 | Semiconductor device and method of forming Fo-WLCSP with recessed interconnect area in peripheral region of semiconductor die | Reza A. Pagaila, Byung Tai Do | 2019-08-20 |
| 10043733 | Integrated circuit packaging system and method of manufacture thereof | Reza A. Pagaila, Byung Tai Do | 2018-08-07 |
| 9893045 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Reza A. Pagaila, Seng Guan Chow, Seung Uk Yoon, Byung Tai Do | 2018-02-13 |
| 9824975 | Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die | Reza A. Pagaila, Byung Tai Do | 2017-11-21 |
| 9799589 | Integrated circuit packaging system with a grid array with a leadframe and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2017-10-24 |
| 9754897 | Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits | Yaojian Lin, Byung Joon Han, Rajendra D. Pendse, Il Kwon Shim, Pandi C. Marimuthu +1 more | 2017-09-05 |
| 9679881 | Semiconductor device and method of forming cavity adjacent to sensitive region of semiconductor die using wafer-level underfill material | Reza A. Pagaila, Byung Tai Do | 2017-06-13 |
| 9620480 | Integrated circuit packaging system with unplated leadframe and method of manufacture thereof | Garret Dimaculangan, Byung Tai Do, Arnel Senosa Trasporto | 2017-04-11 |
| 9576873 | Integrated circuit packaging system with routable trace and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2017-02-21 |
| 9530738 | Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant | Byung Tai Do, Reza A. Pagaila | 2016-12-27 |
| 9449932 | Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die | Byung Tai Do, Arnel Senosa Trasporto, Reza A. Pagaila | 2016-09-20 |
| 9443828 | Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation | Reza A. Pagaila, Byung Tai Do | 2016-09-13 |
| 9431331 | Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure | Byung Tai Do, Reza A. Pagaila | 2016-08-30 |
| 9368423 | Semiconductor device and method of using substrate with conductive posts and protective layers to form embedded sensor die package | Byung Tai Do, Arnel Senosa Trasporto, Asri Yusof | 2016-06-14 |
| 9331002 | Semiconductor device and method of forming through vias with reflowed conductive material | Reza A. Pagaila, Byung Tai Do | 2016-05-03 |
| 9324641 | Integrated circuit packaging system with external interconnect and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2016-04-26 |
| 9324584 | Integrated circuit packaging system with transferable trace lead frame | Byung Tai Do, Arnel Senosa Trasporto | 2016-04-26 |
| 9312194 | Integrated circuit packaging system with terminals and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2016-04-12 |
| 9305873 | Integrated circuit packaging system with electrical interface and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2016-04-05 |
| 9293351 | Integrated circuit packaging system with planarity control and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto, Emmanuel Espiritu | 2016-03-22 |