Issued Patents All Time
Showing 26–50 of 127 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9219029 | Integrated circuit packaging system with terminals and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2015-12-22 |
| 9190349 | Integrated circuit packaging system with leadframe and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto, Asri Yusof | 2015-11-17 |
| 9177901 | Semiconductor device and method of stacking die on leadframe electrically connected by conductive pillars | Reza A. Pagaila, Byung Tai Do | 2015-11-03 |
| 9177897 | Integrated circuit packaging system with trace protection layer and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto, Henry Descalzo Bathan | 2015-11-03 |
| 9177848 | Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer | Byung Tai Do, Heap Hoe Kuan | 2015-11-03 |
| 9123712 | Leadframe system with warp control mechanism and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2015-09-01 |
| 9105620 | Integrated circuit packaging system with routable traces and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto, Asri Yusof | 2015-08-11 |
| 9059011 | Exposed interconnect for a package on package system | Reza A. Pagaila, Byung Tai Do | 2015-06-16 |
| 9048211 | Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation | Reza A. Pagaila, Byung Tai Do | 2015-06-02 |
| 8987064 | Integrated circuit packaging system with molded grid-array mechanism and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2015-03-24 |
| 8963320 | Integrated circuit packaging system with thermal structures and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto, Wei Chun Ang | 2015-02-24 |
| 8963309 | Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof | Byung Tai Do, Seng Guan Chow, Heap Hoe Kuan, Rui Huang | 2015-02-24 |
| 8962393 | Integrated circuit packaging system with heat shield and method of manufacture thereof | Reza A. Pagaila, Byung Tai Do | 2015-02-24 |
| 8957509 | Integrated circuit packaging system with thermal emission and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2015-02-17 |
| 8946870 | Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die | Reza A. Pagaila, Byung Tai Do | 2015-02-03 |
| 8937379 | Integrated circuit packaging system with trenched leadframe and method of manufacture thereof | Byung Tai Do, Asri Yusof, Arnel Senosa Trasporto | 2015-01-20 |
| 8878361 | Leadless package system having external contacts | Byung Tai Do, Heap Hoe Kuan | 2014-11-04 |
| 8841173 | Integrated circuit packaging system with leadframe lead array routing and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2014-09-23 |
| 8823182 | Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant | Byung Tai Do, Reza A. Pagaila | 2014-09-02 |
| 8815643 | Method of fabricating semiconductor die with through-hole via on saw streets and through-hole via in active area of die | Byung Tai Do, Heap Hoe Kuan | 2014-08-26 |
| 8802501 | Integrated circuit packaging system with island terminals and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Emmanuel Espiritu, Byung Tai Do, Arnel Senosa Trasporto | 2014-08-12 |
| 8802500 | Integrated circuit packaging system with leads and method of manufacture thereof | Byung Tai Do, Gai Leong Lai | 2014-08-12 |
| 8791556 | Integrated circuit packaging system with routable circuitry and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2014-07-29 |
| 8759159 | Integrated circuit packaging system with electrical interface and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2014-06-24 |
| 8723305 | Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor | Byung Tai Do, Seng Guan Chow, Heap Hoe Kuan, Rui Huang | 2014-05-13 |