Issued Patents All Time
Showing 51–75 of 127 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8669654 | Integrated circuit packaging system with die paddle and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2014-03-11 |
| 8658470 | Integrated circuit packaging system with formed interconnects and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2014-02-25 |
| 8633063 | Integrated circuit packaging system with pad connection and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2014-01-21 |
| 8629567 | Integrated circuit packaging system with contacts and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2014-01-14 |
| 8623711 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2014-01-07 |
| 8623708 | Integrated circuit packaging system with grid-array mechanism and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2014-01-07 |
| 8592950 | Semiconductor device and method of forming through vias with reflowed conductive material | Reza A. Pagaila, Byung Tai Do | 2013-11-26 |
| 8575769 | Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation | Reza A. Pagaila, Byung Tai Do | 2013-11-05 |
| 8574960 | Semiconductor device and method of forming cavity adjacent to sensitive region of semiconductor die using wafer-level underfill material | Reza A. Pagaila, Byung Tai Do | 2013-11-05 |
| 8569112 | Integrated circuit packaging system with encapsulation and leadframe etching and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2013-10-29 |
| 8558392 | Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant | Byung Tai Do, Reza A. Pagaila | 2013-10-15 |
| 8557638 | Integrated circuit packaging system with pad connection and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2013-10-15 |
| 8546193 | Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure | Byung Tai Do, Reza A. Pagaila | 2013-10-01 |
| 8546195 | Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor | Byung Tai Do, Seng Guan Chow, Heap Hoe Kuan, Rui Huang | 2013-10-01 |
| 8536692 | Mountable integrated circuit package system with mountable integrated circuit die | Heap Hoe Kuan, Seng Guan Chow, Dioscoro A. Merilo | 2013-09-17 |
| 8525325 | Integrated circuit packaging system with leads and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2013-09-03 |
| 8519518 | Integrated circuit packaging system with lead encapsulation and method of manufacture thereof | Byung Tai Do, Reza A. Pagaila, Arnel Senosa Trasporto | 2013-08-27 |
| 8513788 | Integrated circuit packaging system with pad and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto | 2013-08-20 |
| 8502352 | Semiconductor device with conductive vias between saw streets | Reza A. Pagaila, Byung Tai Do | 2013-08-06 |
| 8501541 | Semiconductor device and method of conforming conductive vias between insulating layers in saw streets | Reza A. Pagaila, Byung Tai Do | 2013-08-06 |
| 8492204 | Integrated circuit package-in-package system with wire-in-film encapsulant and method for manufacturing thereof | Byung Tai Do, Seng Guan Chow, Heap Hoe Kuan, Rui Huang | 2013-07-23 |
| 8492201 | Semiconductor device and method of forming through vias with reflowed conductive material | Reza A. Pagaila, Byung Tai Do | 2013-07-23 |
| 8476772 | Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die | Byung Tai Do, Arnel Senosa Trasporto, Reza A. Pagaila | 2013-07-02 |
| 8466057 | Integrated circuit packaging system with filled vias and method of manufacture thereof | Byung Tai Do, Reza A. Pagaila | 2013-06-18 |
| 8406004 | Integrated circuit packaging system and method of manufacture thereof | Reza A. Pagaila, Byung Tai Do | 2013-03-26 |