Issued Patents All Time
Showing 76–100 of 127 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8389330 | Integrated circuit package system with package stand-off and method of manufacture thereof | Byung Tai Do, Reza A. Pagaila | 2013-03-05 |
| 8378477 | Integrated circuit packaging system with film encapsulation and method of manufacture thereof | Byung Tai Do, Reza A. Pagaila | 2013-02-19 |
| 8349657 | Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices | Byung Tai Do, Reza A. Pagaila | 2013-01-08 |
| 8334169 | Integrated circuit packaging system and method of manufacture thereof | Reza A. Pagaila, Byung Tai Do | 2012-12-18 |
| 8283205 | Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die | Reza A. Pagaila, Byung Tai Do | 2012-10-09 |
| 8270176 | Exposed interconnect for a package on package system | Reza A. Pagaila, Byung Tai Do | 2012-09-18 |
| 8258015 | Integrated circuit package system with penetrable film adhesive | Seng Guan Chow, Heap Hoe Kuan | 2012-09-04 |
| 8247268 | Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer | Byung Tai Do, Heap Hoe Kuan | 2012-08-21 |
| 8237252 | Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation | Reza A. Pagaila, Byung Tai Do | 2012-08-07 |
| 8188586 | Mountable integrated circuit package system with mounting interconnects | Seng Guan Chow, Heap Hoe Kuan | 2012-05-29 |
| 8183675 | Integrated circuit package-on-package system with anti-mold flash feature | Seng Guan Chow, Heap Hoe Kuan | 2012-05-22 |
| 8168458 | Semiconductor device and method of forming bond wires and stud bumps in recessed region of peripheral area around the device for electrical interconnection to other devices | Byung Tai Do, Reza A. Pagaila | 2012-05-01 |
| 8169058 | Semiconductor device and method of stacking die on leadframe electrically connected by conductive pillars | Reza A. Pagaila, Byung Tai Do | 2012-05-01 |
| 8164184 | Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices | Byung Tai Do, Reza A. Pagaila | 2012-04-24 |
| 8143098 | Integrated circuit packaging system with interposer and method of manufacture thereof | Byung Tai Do, Sharon Ooi, Reza A. Pagaila | 2012-03-27 |
| 8143711 | Integrated circuit package system with offset stacking and anti-flash structure | Seng Guan Chow, Heap Hoe Kuan | 2012-03-27 |
| 8119447 | Integrated circuit packaging system with through via die having pedestal and recess and method of manufacture thereof | Reza A. Pagaila, Byung Tai Do | 2012-02-21 |
| 8110913 | Integrated circuit package system with integral inner lead and paddle | Byung Tai Do, Zheng Zheng, Lee Sun Lim | 2012-02-07 |
| 8097490 | Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die | Reza A. Pagaila, Byung Tai Do | 2012-01-17 |
| 8084302 | Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor | Byung Tai Do, Seng Guan Chow, Heap Hoe Kuan, Rui Huang | 2011-12-27 |
| 8084849 | Integrated circuit package system with offset stacking | Seng Guan Chow, Heap Hoe Kuan | 2011-12-27 |
| 8080882 | Semiconductor device and method of forming stepped-down RDL and recessed THV in peripheral region of the device | Byung Tai Do, Heap Hoe Kuan, Reza A. Pagaila | 2011-12-20 |
| 8063477 | Integrated circuit packaging system having asymmetric encapsulation structures and method of manufacture thereof | Reza A. Pagaila, Byung Tai Do | 2011-11-22 |
| 8049314 | Integrated circuit package system with insulator over circuitry | Byung Tai Do, Seng Guan Chow, Heap Hoe Kuan, Rui Huang | 2011-11-01 |
| 8030136 | Semiconductor device and method of conforming conductive vias between insulating layers in saw streets | Reza A. Pagaila, Byung Tai Do | 2011-10-04 |