Issued Patents All Time
Showing 126–127 of 127 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7566966 | Integrated circuit package-on-package system with anti-mold flash feature | Seng Guan Chow, Heap Hoe Kuan | 2009-07-28 |
| 7553752 | Method of making a wafer level integration package | Heap Hoe Kuan, Seng Guan Chow | 2009-06-30 |