Issued Patents All Time
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8124490 | Semiconductor device and method of forming passive devices | Yaojian Lin, Qing Zhang, Robert C. Frye | 2012-02-28 |
| 8110477 | Semiconductor device and method of forming high-frequency circuit structure and method thereof | Yaojian Lin, Jianmin Fang, Kang Chen | 2012-02-07 |
| 8026593 | Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof | Yaojian Lin, Qing Zhang | 2011-09-27 |
| 8008770 | Integrated circuit package system with bump pad | Yaojian Lin, Romeo Emmanuel P. Alvarez, Wan Lay Looi | 2011-08-30 |
| 7993972 | Wafer level die integration and method therefor | Yaojian Lin | 2011-08-09 |
| 7935570 | Semiconductor device and method of embedding integrated passive devices into the package electrically interconnected using conductive pillars | Yaojian Lin, Jianmin Fang, Kang Chen | 2011-05-03 |
| 7858441 | Semiconductor package with semiconductor core structure and method of forming same | Yaojian Lin, Jianmin Fang, Kang Chen | 2010-12-28 |
| 7790503 | Semiconductor device and method of forming integrated passive device module | Yaojian Lin, Qing Zhang, Kang Chen, Jianmin Fang | 2010-09-07 |
| 7772081 | Semiconductor device and method of forming high-frequency circuit structure and method thereof | Yaojian Lin, Jianmin Fang, Kang Chen | 2010-08-10 |
| 7772106 | Method of forming an inductor on a semiconductor wafer | Yaojian Lin, Qing Zhang | 2010-08-10 |
| 7749814 | Semiconductor device with integrated passive circuit and method of making the same using sacrificial substrate | Yaojian Lin, Kang Chen, Qing Zhang, Jianmin Fang | 2010-07-06 |
| 7727876 | Semiconductor device and method of protecting passivation layer in a solder bump process | Yaojian Lin, Qing Zhang | 2010-06-01 |
| 7691747 | Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures | Yaojian Lin, Qing Zhang, Kang Chen, Jianmin Fang | 2010-04-06 |
| 7682959 | Method of forming solder bump on high topography plated Cu | Yaojian Lin, Qing Zhang | 2010-03-23 |
| 7381634 | Integrated circuit system for bonding | Yaojian Lin, Byung Tai Do, Wan Lay Looi | 2008-06-03 |