TW

Tie Wang

AP Advanpack Solutions Pte: 3 patents #9 of 37Top 25%
BB Bwt Beijing: 1 patents #6 of 13Top 50%
SS St Assembly Test Services: 1 patents #36 of 63Top 60%
University of Florida: 1 patents #1,174 of 2,560Top 50%
Overall (All Time): #836,029 of 4,157,543Top 25%
6
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10310278 Semiconductor laser Xiaochen Jiang, Weirong Guo, Baohua Wang, Rui Liu, Lei Xu 2019-06-04
9291758 Laterally aligned colloidal nanorods assemblies Yunwei Charles Cao, Xirui Wang 2016-03-22
7153725 Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor Virgil Ararao, Il Kwon Shim, Sheila Marie L. Alvarez 2006-12-26
7087458 Method for fabricating a flip chip package with pillar bump and no flow underfill Ping Miao, Chun Sing Colin Lum, Yixin Chew 2006-08-08
6467676 Fluxing adhesive 2002-10-22
6365435 Method for producing a flip chip package Colin Chun Sing Lum 2002-04-02