Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7087458 | Method for fabricating a flip chip package with pillar bump and no flow underfill | Tie Wang, Ping Miao, Yixin Chew | 2006-08-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7087458 | Method for fabricating a flip chip package with pillar bump and no flow underfill | Tie Wang, Ping Miao, Yixin Chew | 2006-08-08 |