Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7087458 | Method for fabricating a flip chip package with pillar bump and no flow underfill | Tie Wang, Ping Miao, Chun Sing Colin Lum | 2006-08-08 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7087458 | Method for fabricating a flip chip package with pillar bump and no flow underfill | Tie Wang, Ping Miao, Chun Sing Colin Lum | 2006-08-08 |