FD

Frederick R. Dahilig

SC Stats Chippac: 18 patents #53 of 425Top 15%
CH Chippac: 1 patents #23 of 42Top 55%
Overall (All Time): #237,271 of 4,157,543Top 6%
19
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
RE47923 Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Arnel Senosa Trasporto, Henry Descalzo Bathan 2020-03-31
9666540 Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Dioscoro A. Merilo 2017-05-30
9257357 Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Dioscoro A. Merilo 2016-02-09
9142514 Semiconductor device and method of forming wafer level die integration Zigmund Ramirez Camacho, Dioscoro A. Merilo, Lionel Chien Hui Tay 2015-09-22
8937393 Integrated circuit package system with device cavity Henry Descalzo Bathan, Zigmund Ramirez Camacho, Lionel Chien Hui Tay 2015-01-20
8890328 Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers Zigmund Ramirez Camacho, Dioscoro A. Merilo, Jairus Legaspi Pisigan 2014-11-18
8884418 Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps Zigmund Ramirez Camacho, Lionel Chien Hui Tay 2014-11-11
8810015 Integrated circuit packaging system with high lead count and method of manufacture thereof Zigmund Ramirez Camacho, Henry Descalzo Bathan 2014-08-19
8518749 Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Dioscoro A. Merilo 2013-08-27
8405230 Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof Jae Soo Lee, Geun Sik Kim, Sheila Marie L. Alvarez, Robinson Quiazon, Hin Hwa Goh 2013-03-26
8344495 Integrated circuit packaging system with interconnect and method of manufacture thereof Zigmund Ramirez Camacho, Philip Lyndon Cablao, Lionel Chien Hui Tay 2013-01-01
8283209 Semiconductor device and method of forming PiP with inner known good die interconnected with conductive bumps Zigmund Ramirez Camacho, Lionel Chien Hui Tay 2012-10-09
8241954 Wafer level die integration and method Zigmund Ramirez Camacho, Dioscoro A. Merilo, Lionel Chien Hui Tay 2012-08-14
8174127 Integrated circuit package system employing device stacking Sheila Marie L. Alvarez, Antonio B. Dimaano, Jr., Dioscoro A. Merilo 2012-05-08
8120187 Integrated circuit package system employing device stacking and method of manufacture thereof Sheila Marie L. Alvarez, Antonio B. Dimaano, Jr., Dioscoro A. Merilo 2012-02-21
8105915 Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers Zigmund Ramirez Camacho, Dioscoro A. Merilo, Jairus Legaspi Pisigan 2012-01-31
8022539 Integrated circuit packaging system with increased connectivity and method of manufacture thereof Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay 2011-09-20
7880313 Semiconductor flip chip package having substantially non-collapsible spacer Jae Soo Lee, Geun Sik Kim, Sheila Marie L. Alvarez, Robinson Quiazon, Hin Hwa Goh 2011-02-01
7830020 Integrated circuit package system employing device stacking Sheila Marie L. Alvarez, Antonio B. Dimaano, Jr., Dioscoro A. Merilo 2010-11-09