Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8405230 | Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof | Jae Soo Lee, Geun Sik Kim, Sheila Marie L. Alvarez, Hin Hwa Goh, Frederick R. Dahilig | 2013-03-26 |
| 7880313 | Semiconductor flip chip package having substantially non-collapsible spacer | Jae Soo Lee, Geun Sik Kim, Sheila Marie L. Alvarez, Hin Hwa Goh, Frederick R. Dahilig | 2011-02-01 |
| 7482683 | Integrated circuit encapsulation system with vent | Antonio B. Dimaano, Jr., Erick Dahilig, Sheila Marie L. Alvarez, Jose Alvin Caparas | 2009-01-27 |
| 7443015 | Integrated circuit package system with downset lead | Jeffrey D. Punzalan, Sheila Marie L. Alvarez, Jose Alvin Caparas | 2008-10-28 |
| 7414318 | Etched leadframe flipchip package system | Il Kwon Shim, Sheila Marie L. Alvarez, Hin Hwa Goh | 2008-08-19 |
| 7250685 | Etched leadframe flipchip package system | Il Kwon Shim, Sheila Marie L. Alvarez, Hin Hwa Goh | 2007-07-31 |