Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die

Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die

US Patent 10903183 · Granted Jan 26, 2021

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic device for WLAN communication with plurality of external devices and 2025
Method for managing persistent group information of electronic device2025
Semiconductor device and method of integrating RF antenna interposer with semico2024
Electronic device and method for performing service discovery in electronic devi2023
Semiconductor device and method of integrating RF antenna interposer with semico2023
Semiconductor device and method of forming interposer with opening to contain se2023
Device and method for transmitting signals in plurality of frequency bands2022
Electronic device and method for forming Wi-Fi direct group thereof2022
Method and apparatus for allocating IP address in wireless communication network2022
Electronic device and method for forming Wi-Fi direct group thereof2020
Semiconductor device and method of forming ultra thin multi-die face-to-face WLC2020
Semiconductor device and method of forming ultra thin multi-die face-to-face WLC2020