Issued Patents All Time
Showing 51–75 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8710634 | Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof | Jae Han Chung, Junwoo Myung, Yeonglm Park, HyungMin Lee | 2014-04-29 |
| 8624370 | Integrated circuit packaging system with an interposer and method of manufacture thereof | NamJu Cho, Taewoo Lee | 2014-01-07 |
| 8587129 | Integrated circuit packaging system with through silicon via base and method of manufacture thereof | NamJu Cho, YeongIm Park | 2013-11-19 |
| 8564125 | Integrated circuit packaging system with embedded thermal heat shield and method of manufacture thereof | NamJu Cho, HanGil Shin | 2013-10-22 |
| 8541872 | Integrated circuit package system with package stacking and method of manufacture thereof | NamJu Cho, HanGil Shin | 2013-09-24 |
| 8492888 | Integrated circuit packaging system with stiffener and method of manufacture thereof | NamJu Cho, HanGil Shin | 2013-07-23 |
| 8476111 | Integrated circuit packaging system with intra substrate die and method of manufacture thereof | NamJu Cho, HanGil Shin | 2013-07-02 |
| 8471394 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | Ki Youn Jang, NamJu Cho | 2013-06-25 |
| 8460968 | Integrated circuit packaging system with post and method of manufacture thereof | DongSam Park, HanGil Shin | 2013-06-11 |
| 8455300 | Integrated circuit package system with embedded die superstructure and method of manufacture thereof | NamJu Cho, ChanHoon Ko | 2013-06-04 |
| 8426955 | Integrated circuit packaging system with a stack package and method of manufacture thereof | YeongIm Park, HyungMin Lee | 2013-04-23 |
| 8421210 | Integrated circuit packaging system with dual side connection and method of manufacture thereof | Soo Jung Park, Junwoo Myung | 2013-04-16 |
| 8421203 | Integrated circuit packaging system with foldable substrate and method of manufacture thereof | NamJu Cho, HanGil Shin | 2013-04-16 |
| 8409917 | Integrated circuit packaging system with an interposer substrate and method of manufacture thereof | In Sang Yoon, HanGil Shin | 2013-04-02 |
| 8390108 | Integrated circuit packaging system with stacking interconnect and method of manufacture thereof | NamJu Cho, HanGil Shin, Rui Huang, Seng Guan Chow, Heap Hoe Kuan | 2013-03-05 |
| 8389329 | Integrated circuit packaging system with package stacking and method of manufacture thereof | NamJu Cho, HanGil Shin | 2013-03-05 |
| 8384227 | Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die | NamJu Cho, HanGil Shin | 2013-02-26 |
| 8357564 | Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die | YeongIm Park, HyungMin Lee | 2013-01-22 |
| 8349658 | Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe | NamJu Cho, HanGil Shin | 2013-01-08 |
| 8350368 | Semiconductor device and method of forming shielding layer after encapsulation and grounded through interconnect structure | NamJu Cho, HanGil Shin | 2013-01-08 |
| 8318539 | Method of manufacture of integrated circuit packaging system with multi-tier conductive interconnects | NamJu Cho, HanGil Shin | 2012-11-27 |
| 8318541 | Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die | HanGil Shin, NamJu Cho | 2012-11-27 |
| 8314486 | Integrated circuit packaging system with shield and method of manufacture thereof | NamJu Cho, HyungSang Park | 2012-11-20 |
| 8288209 | Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die | NamJu Cho, HanGil Shin | 2012-10-16 |
| 8264091 | Integrated circuit packaging system with encapsulated via and method of manufacture thereof | NamJu Cho, HanGil Shin | 2012-09-11 |