Issued Patents All Time
Showing 76–85 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8202797 | Integrated circuit system with recessed through silicon via pads and method of manufacture thereof | NamJu Cho, HanGil Shin | 2012-06-19 |
| 8143097 | Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP | NamJu Cho, HanGil Shin | 2012-03-27 |
| 8138014 | Method of forming thin profile WLCSP with vertical interconnect over package footprint | NamJu Cho, HanGil Shin | 2012-03-20 |
| 8106498 | Integrated circuit packaging system with a dual board-on-chip structure and method of manufacture thereof | HanGil Shin, A Leam Choi | 2012-01-31 |
| 8039316 | Integrated circuit packaging system with stacked integrated circuit and heat spreader with openings and method of manufacture thereof | Soo Jung Park, HanGil Shin | 2011-10-18 |
| 8035235 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | Ki Youn Jang, NamJu Cho | 2011-10-11 |
| 8018034 | Semiconductor device and method of forming shielding layer after encapsulation and grounded through interconnect structure | NamJu Cho, HanGil Shin | 2011-09-13 |
| 7968995 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | Chan Hoon Ko, Soo-San Park | 2011-06-28 |
| 7928552 | Integrated circuit packaging system with multi-tier conductive interconnects and method of manufacture thereof | NamJu Cho, HanGil Shin | 2011-04-19 |
| 7863735 | Integrated circuit packaging system with a tiered substrate package and method of manufacture thereof | NamJu Cho, HanGil Shin | 2011-01-04 |