Issued Patents All Time
Showing 26–50 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9385100 | Integrated circuit packaging system with surface treatment and method of manufacture thereof | Hun Teak Lee, YoungChul Kim, Hyunll Bae, HeeSoo Lee | 2016-07-05 |
| 9362161 | Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package | HanGil Shin, NamJu Cho | 2016-06-07 |
| 9355939 | Integrated circuit package stacking system with shielding and method of manufacture thereof | NamJu Cho, HanGil Shin | 2016-05-31 |
| 9331003 | Integrated circuit packaging system with pre-molded leadframe and method of manufacture thereof | Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong | 2016-05-03 |
| 9330994 | Semiconductor device and method of forming RDL and vertical interconnect by laser direct structuring | Zigmund Ramirez Camacho, Bartholomew Liao, Sheila Marie L. Alvarez, Kelvin Dao | 2016-05-03 |
| 9299650 | Integrated circuit packaging system with single metal layer interposer and method of manufacture thereof | HanGil Shin, NamJu Cho, Kyung-Moon Kim | 2016-03-29 |
| 9287204 | Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form | KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang +3 more | 2016-03-15 |
| 9269595 | Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint | NamJu Cho, HanGil Shin | 2016-02-23 |
| 9269691 | Semiconductor device and method of making an embedded wafer level ball grid array (EWLB) package on package (POP) device with a slotted metal carrier interposer | HanGil Shin, NamJu Cho | 2016-02-23 |
| 9263332 | Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP | NamJu Cho, HanGil Shin | 2016-02-16 |
| 9252130 | Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding | KyungMoon Kim, YoungChul Kim, HunTeak Lee, KeonTaek Kang | 2016-02-02 |
| 9245770 | Semiconductor device and method of simultaneous molding and thermalcompression bonding | KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang +2 more | 2016-01-26 |
| 9240331 | Semiconductor device and method of making bumpless flipchip interconnect structures | KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang +3 more | 2016-01-19 |
| 9202793 | Integrated circuit packaging system with under bump metallization and method of manufacture thereof | Il Kwon Shim, Kyung-Moon Kim, JunMo Koo, Bartholomew Liao, Zigmund Ramirez Camacho | 2015-12-01 |
| 9153476 | Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die | YeongIm Park, HyungMin Lee | 2015-10-06 |
| 9064859 | Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe | NamJu Cho, HanGil Shin | 2015-06-23 |
| 9054098 | Integrated circuit packaging system with redistribution layer and method of manufacture thereof | NamJu Cho, ChanHoon Ko | 2015-06-09 |
| 9048306 | Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP | NamJu Cho, HanGil Shin | 2015-06-02 |
| 8951834 | Methods of forming solder balls in semiconductor packages | Kyung-Moon Kim, Il Kwon Shim, HanGil Shin | 2015-02-10 |
| 8932907 | Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die | NamJu Cho, HanGil Shin | 2015-01-13 |
| 8901755 | Semiconductor device and method of forming conductive layer over metal substrate for electrical interconnect of semiconductor die | NamJu Cho, HanGil Shin | 2014-12-02 |
| 8749040 | Integrated circuit packaging system with package-on-package and method of manufacture thereof | NamJu Cho, HanGil Shin | 2014-06-10 |
| 8723309 | Integrated circuit packaging system with through silicon via and method of manufacture thereof | HanGil Shin, YeongIm Park | 2014-05-13 |
| 8716065 | Integrated circuit packaging system with encapsulation and method of manufacture thereof | NamJu Cho, HanGil Shin | 2014-05-06 |
| 8710668 | Integrated circuit packaging system with laser hole and method of manufacture thereof | HyungMin Lee, YeongIm Park | 2014-04-29 |