Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit packaging system with support structure and method of manufacture thereof

Integrated circuit packaging system with support structure and method of manufacture thereof

US Patent 9502267 · Granted Nov 22, 2016

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device and method of forming interposer with opening to contain se2023
Semiconductor device and method of forming mold degating structure for pre-molde2022
Semiconductor device and method of using leadframe bodies to form openings throu2021
Semiconductor device and method of forming wafer level ground plane and power ri2020
Semiconductor device and method of forming PIP with inner known good die interco2020
Semiconductor device and method of forming ultra thin multi-die face-to-face WLC2020
Semiconductor device and method of forming 3D dual side die embedded build-up se2019
Semiconductor device and method of forming wire studs as vertical interconnect i2019
Integrated circuit packaging system with substrate and method of manufacture the2018
Integrated circuit packaging system with substrate and method of manufacture the2018
Semiconductor device and method of forming interposer frame electrically connect2018
Semiconductor device and method of forming package-on-package structure electric2018