Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereof

Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereof

US Patent 9859200 · Granted Jan 2, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device and method of forming conductive structure for EMI shieldin2025
Apparatus for manufacturing display apparatus and method of manufacturing displa2025
Semiconductor device and method of forming graphene-coated core embedded within 2025
Semiconductor device and method of disposing electrical components over side sur2025
Cooling device and process for cooling double-sided SiP devices during sputterin2025
Method and apparatus for codebook design in communication system2025
Method and apparatus for converting hydrocarbon-based material into acetylene or2025
Beam search method and apparatus in smart repeater system2025
Semiconductor device and method for advanced thermal dissipation2025
Molded laser package with electromagnetic interference shield and method of maki2025
Semiconductor device and method of making a photonic semiconductor package2025
Integrated antenna-in-package structure2025