Issued Patents All Time
Showing 51–75 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8519544 | Semiconductor device and method of forming WLCSP structure using protruded MLP | OhHan Kim, SungWon Cho, KyuWon Lee, DongSoo Moo | 2013-08-27 |
| 8518752 | Integrated circuit packaging system with stackable package and method of manufacture thereof | DeokKyung Yang | 2013-08-27 |
| 8519536 | Semiconductor device including bump formed on substrate to prevent extremely-low dielectric constant (ELK) interlayer dielectric layer (ILD) delamination during reflow process | KiYoun Jang, OhHan Kim, DongSoo Moon | 2013-08-27 |
| 8513057 | Integrated circuit packaging system with routable underlayer and method of manufacture thereof | Oh Han Kim, Ki Youn Jang, DongSoo Moon | 2013-08-20 |
| 8502387 | Integrated circuit packaging system with vertical interconnection and method of manufacture thereof | Taewoo Lee, KyuWon Lee, SungWon Cho | 2013-08-06 |
| 8481420 | Integrated circuit packaging system with lead frame stacking module and method of manufacture thereof | Jong-Woo Ha, Byoung Wook Jang | 2013-07-09 |
| 8476115 | Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive material | Sang Mi Park, KyungHoon Lee | 2013-07-02 |
| 8466567 | Integrated circuit packaging system with stack interconnect and method of manufacture thereof | SangMi Park, Oh Han Kim | 2013-06-18 |
| 8461680 | Integrated circuit packaging system with rounded interconnect | JoHyun Bae, SungWon Cho | 2013-06-11 |
| 8409923 | Integrated circuit packaging system with underfill and method of manufacture thereof | Oh Han Kim, Yong Hee Kang | 2013-04-02 |
| 8409979 | Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties | OhHan Kim, SungWon Cho | 2013-04-02 |
| 8409921 | Integrated circuit package system including honeycomb molding | Heap Hoe Kuan, Hamid Eslampour, Rui Huang, Taeg Ki Lim | 2013-04-02 |
| 8405197 | Integrated circuit packaging system with stacked configuration and method of manufacture thereof | Jong-Woo Ha, Byoung Wook Jang | 2013-03-26 |
| 8383458 | Integrated circuit package system employing an offset stacked configuration and method for manufacturing thereof | BumJoon Hong, Sang Ho Lee, Jong-Woo Ha, Soo-San Park | 2013-02-26 |
| 8367467 | Semiconductor method of forming bump on substrate to prevent ELK ILD delamination during reflow process | KiYoun Jang, OhHan Kim, DongSoo Moon | 2013-02-05 |
| 8288203 | Semiconductor device and method of forming a wafer level package structure using conductive via and exposed bump | SungWon Cho, JoonYoung Choi | 2012-10-16 |
| 8273604 | Semiconductor device and method of forming WLCSP structure using protruded MLP | OhHan Kim, SungWon Cho, KyuWon Lee, DongSoo Moo | 2012-09-25 |
| 8273607 | Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof | Soo-San Park, Sang Ho Lee | 2012-09-25 |
| 8263435 | Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias | WonJun Ko, JaEun Yun | 2012-09-11 |
| 8232141 | Integrated circuit packaging system with conductive pillars and method of manufacture thereof | JoHyun Bae, Junghoon Shin | 2012-07-31 |
| 8189344 | Integrated circuit package system for stackable devices | Sang Ho Lee, Soo-San Park | 2012-05-29 |
| 8168317 | Battery module of improved safety and middle or large-sized battery pack containing the same | Hee Soo Yoon, Dal-Mo Kang, HanHo Lee, Jeeho Kim, Jongmoon Yoon +5 more | 2012-05-01 |
| 8067307 | Integrated circuit package system for stackable devices | Sang Ho Lee, Soo-San Park | 2011-11-29 |
| 8063475 | Semiconductor package system with through silicon via interposer | DeokKyung Yang, Seung-Won Kim | 2011-11-22 |
| 8039275 | Integrated circuit packaging system with rounded interconnect and method of manufacture thereof | JoHyun Bae, SungWon Cho | 2011-10-18 |