Issued Patents All Time
Showing 26–50 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8994192 | Integrated circuit packaging system with perimeter antiwarpage structure and method of manufacture thereof | — | 2015-03-31 |
| 8941225 | Integrated circuit package and method for manufacturing the same | Seung Hoon Oh | 2015-01-27 |
| 8895440 | Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMV | Young Jin Woo, Taewoo Lee | 2014-11-25 |
| 8884339 | Semiconductor device with bump formed on substrate to prevent ELK ILD delamination during reflow process | KiYoun Jang, OhHan Kim, DongSoo Moon | 2014-11-11 |
| 8853855 | Integrated circuit packaging system with conductive pillars and molded cavities and method of manufacture thereof | KyungHoon Lee, Sooyoung Lee | 2014-10-07 |
| 8823160 | Integrated circuit package system having cavity | Jong-Woo Ha, DeokKyung Yang | 2014-09-02 |
| 8748233 | Integrated circuit packaging system with underfill and method of manufacture thereof | Oh Han Kim, Jung Sell | 2014-06-10 |
| 8723310 | Integrated circuit packaging system having warpage prevention structures | YiSu Park, KyungHoon Lee, Joungln Yang, SangMi Park | 2014-05-13 |
| 8709935 | Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties | OhHan Kim, SungWon Cho | 2014-04-29 |
| 8710640 | Integrated circuit packaging system with heat slug and method of manufacture thereof | JoungIn Yang, Minjung Kim, KyungEun KIM | 2014-04-29 |
| 8710670 | Integrated circuit packaging system with coupling features and method of manufacture thereof | Minjung Kim, Wonll Kwon | 2014-04-29 |
| 8703538 | Integrated circuit packaging system with external wire connection and method of manufacture thereof | — | 2014-04-22 |
| 8703535 | Integrated circuit packaging system with warpage preventing mechanism and method of manufacture thereof | Minjung Kim, MinWook Yu, YiSu Park | 2014-04-22 |
| 8698297 | Integrated circuit packaging system with stack device | JoHyun Bae, In Sang Yoon | 2014-04-15 |
| 8685797 | Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof | Soo-San Park, Sang Ho Lee | 2014-04-01 |
| 8679900 | Integrated circuit packaging system with heat conduction and method of manufacture thereof | SangMi Park, Minjung Kim, MinWook Yu | 2014-03-25 |
| 8648469 | Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate | Jongho Kim, HyungMin Lee | 2014-02-11 |
| 8642469 | Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer | JoonYoung Choi, Wonll Kwon | 2014-02-04 |
| 8642381 | Semiconductor device and method of forming protective layer over exposed surfaces of semiconductor die | Reza A. Pagaila, Jun Mo Koo | 2014-02-04 |
| 8633058 | Integrated circuit packaging system with step mold and method of manufacture thereof | Jong-Woo Ha, Seung-Won Kim | 2014-01-21 |
| 8603859 | Integrated circuit packaging system with dual side mold and method of manufacture thereof | DeokKyung Yang | 2013-12-10 |
| 8592973 | Integrated circuit packaging system with package-on-package stacking and method of manufacture thereof | HyungSang Park, DeokKyung Yang | 2013-11-26 |
| 8574964 | Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tape | SungWon Cho, Taewoo Lee, KyuWon Lee | 2013-11-05 |
| 8559185 | Integrated circuit package system with stackable devices and a method of manufacture thereof | Sang Ho Lee, Soo-San Park | 2013-10-15 |
| 8546194 | Integrated circuit packaging system with interconnects and method of manufacture thereof | JoonYoung Choi, YongHyuk Jeong | 2013-10-01 |