Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11970642 | Method for bonding objects using thermoset polyimide layers | Sahnggi Park | 2024-04-30 |
| 11746259 | Optical module and method for manufacturing the same | Sahnggi Park | 2023-09-05 |
| 11249261 | Optical module and optical communication network system having the same | Sahnggi Park | 2022-02-15 |
| 8710640 | Integrated circuit packaging system with heat slug and method of manufacture thereof | DaeSik Choi, JoungIn Yang, Minjung Kim | 2014-04-29 |