Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9252093 | Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer | DaeSik Choi, JoonYoung Choi | 2016-02-02 |
| 8710670 | Integrated circuit packaging system with coupling features and method of manufacture thereof | Minjung Kim, DaeSik Choi | 2014-04-29 |
| 8642469 | Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer | DaeSik Choi, JoonYoung Choi | 2014-02-04 |