Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10068877 | Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure | KyungHoon Lee, HyunJin Song, DaeSik Choi | 2018-09-04 |
| 9349616 | Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure | KyungHoon Lee, HyunJin Song, DaeSik Choi | 2016-05-24 |